Samuel Chiu (Applied Materials Taiwan, TAIWAN)
Jenq-Gong Duh (National Tsing Hua University, TAIWAN)
"Solder Joint Reliability in Microbump for Microelectronic Packages via Thin Film Metallization and Doping by Surface Modification Techniques"
ISPlasma2024 / IC-PLANTS2024 Secretariat / APSPT-13
Inter Group Corp.
Orchid Building 8F, 2-38-2, Meieki, Nakamura-ku, Nagoya, 450-0002 JAPAN
+81-52-581-3241
+81-52-581-5585
isplasma2024_apspt-13@intergroup.co.jpSecretariat:Inter Group Corp. Phone:+81-52-581-3241 Fax:+81-52-581-5585 E-mail:isplasma2024_apspt-13@intergroup.co.jp
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